Semiconductor

A semiconductor product is the final or intermediate form of an incorporated circuit in a chip. It has an electronic function.

PVD Materials

Semiconductors

> Sputtering Targets
> Evaporation Slugs & Pellets
> High Purity Metals

PVD Materials

Semiconductors
> Sputtering Targets
> Evaporation Slugs & Pellets
> High Purity Metals
Packaging Materials

Semiconductors

> Bonding wires and Ribbon
> Lids
> Solder Alloy

Packaging Materials

Semiconductors
> Bonding wires and Ribbon
> Lids
> Solder Alloy

Wafer Back Grinding / Dicing Process Consumables

Film/Tape

Semiconductors

> EMI Shield Tape
> Mold Release Film
> UV Tape
> Blue Tape
> QFN/DFN Backside Tape
> Water Soluble Tape

Specialty Film:
> PFA Mold Release Film
> ETFE Mold Release Film
> QFN Mold Release Film (Liner or Non Liner type

Adhesives Film:
> Die Attach Film (DAF)
> UV Dicing Tape
> Dicing Die Attach Film (DDAF)
> Conductive Die Attach Film (CDAF)

Film/Tape

Semiconductors

> EMI Shield Tape
> Mold Release Film
> UV Tape
> Blue Tape
> QFN/DFN Backside Tape
> Water Soluble Tape

Specialty Film:
> PFA Mold Release Film
> ETFE Mold Release Film
> QFN Mold Release Film (Liner or Non Liner type

Adhesives Film:
> Die Attach Film (DAF)
> UV Dicing Tape
> Dicing Die Attach Film (DDAF)
> Conductive Die Attach Film (CDAF)

Dresser Board

Semiconductors

> Cost Savings
> Longer Life Time
> Various Grit size for different application

Dresser Board<

Semiconductors

> Cost Savings
> Longer Life Time
> Various Grit size for different application

Wafers

Semiconductors

> Prime / Test / Dummy test wafers
> Thermal oxide layered wafers< > Customisation eg; Single Side polished > Various Sizes 2", 3", 4", 6", 8" and 12

Wafers

Semiconductors

> Prime / Test / Dummy test wafers
> Thermal oxide layered wafers
> Customisation eg; Single Side polished
> Various Sizes 2", 3", 4", 6", 8" and 12

EHWA

Semiconductors

> Dicing Blades
> Back Grinding Wheels
> Microblades
> CMP Conditioners

EHWA

Semiconductors

> Dicing Blades
> Back Grinding Wheels
> Microblades
> CMP Conditioners

MIT Eco Innovation

Semiconductors

Chemical:
> Hyper Pro (Wafer Dicing Surfactant)
> Hyper Star (Laser Scribing Coating Solution)
> Hyper Max (Flux Residue Cleaning solution)
> Hyper Blue (Wafer Photolithography Solution)
> Hyper Clean (Package Sawing Cleaning Solution)tion

MIT Eco Innovation

Semiconductors

Chemical:
> Hyper Pro (Wafer Dicing Surfactant)
> Hyper Star (Laser Scribing Coating Solution)
> Hyper Max (Flux Residue Cleaning solution)
> Hyper Blue (Wafer Photolithography Solution)
> Hyper Clean (Package Sawing Cleaning Solution)tion

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